Everyone in the future will have an iphone "partner" of their own.

I don't know if technology is developing so far. Will Siri in the iPhone have a chance to become our buddy in the future? Call our brother?

Today, 30 years later, artificial intelligence has begun to develop into smart handheld devices. The iPhone dock Moboto was developed based on such a goal. The iPhone Dock, called Moboto, is designed to help you turn your iPhone into the head of a robot, turning the entire device together with the Dock into a robot and becoming your "little man"! The following design reminds me of the magic. The eye of Sauron.

When the future Siri technology is more mature, combined with this man-machine interface and software, you can even change the way Siri talks. The commonly used mobile phone display functions such as: weather, alarm clock, battery capacity, etc. can be used for these cute expressions. To convey it! Is the voice and expression animation very user-friendly? The big screen has become the face of this hardware structure. In addition to opening your eyes and closing your eyes, you will see the left and right. The anthropomorphic design is quite cute.

Before you even pick up your iPhone, it's just an ordinary robot, although it seems that the expression is not smart enough. . .

Once connected to the Smart Phone!! Your life will change because of this gadget!

After the setup is complete, just plug in the Dock, Moboto can make iOS into a variety of images!

Of course, when we use Facetime at the same time, watching this robot will feel very good. Different scenes, different designs, you can also choose different Dock and Moboto personality expressions.

This base is really a toy robot. We can convert it to your favorite action, and you can replace the foot or body to become a different function. We can also turn it into a cute flower pot.

I think this base has a lot of design development space.

PGA Sockets Adapters

PGA Sockets Pin Grid Array Socket
A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).

PGA Sockets & Adapters
Low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns.

PGA Sockets & Adapters Overview
Durable construction for virtually any application
Wide variety of materials, lengths, and sizes
Cost-effective method for replacing, repairing, or upgrading PGA devices
Unique options such as solder preform terminals eliminate the need for wave soldering in mixed SMT/Thru-hole applications
RoHS compliant insulators and screw-machined terminals are compatible with lead-free processing - select either Matte Tin/Gold (MG) or Gold/Gold (GG) plating

Antenk's Pin Grid Array (PGA) Sockets
Complex printed circuits are too valuable to risk direct soldering to expensive integrated circuits (ICs). Using a socket is the answer. The use of sockets offers advantages that prove cost effective and simplify board design.

Antenk's processor socket line is designed for use with Intel- and AMD-based microprocessor packages. Socket types include land grid array (LGA), micro pin grid array (mPGA), and PGA with low to zero insertion force. The mPGA and PGA sockets are designed for various microprocessor packages for notebook PCs, desktop PCs, and servers. For custom applications, the compression sockets can be configured to the specific application.

mPGA/PGA (ZIF)
These sockets provide a zero insertion force (ZIF) PGA interface to the microprocessor PGA package and are attached to the PCB with surface-mount technology (SMT) soldering. PGA sockets are available in arrays up to 989 positions with single lever, screw driver, and hex wrench actuation methods.
PGA Sockets (LIF)
These sockets are primarily employed for microprocessor package test applications using through-hole solder attachment to the PCB design. The contacts are screw-machine outer sleeves with either stamped and formed or drawn inner contacts. Custom arrays are available in more than 1,000 positions.

Pin Grid Array (PGA) Sockets Type
mPGA
PGA

PGA

PGA Sockets Typical Applications:
Eliminate hand-loading of pins, facilitate solder joint visibility, low profile component mounting or board mating.

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