Hilscher Provides Easy Path to IoT Process Data to the Cloud

With the increasing demand for predictive maintenance and analysis of big data applications in the field of automation, the demand for plant-level process data has become more and more prominent, and it is a key element. In order to obtain these process data from the production network, the edge gateway device can easily build a “bridge” of OT and IT data to fill this gap. So far, if an existing system wants to implement IoT communication, it can only be achieved by creating new projects and tedious programming on the PLC. In other words, the process data required by the IoT application is acquired by the PLC and transmitted to the cloud through the PLC.

Hirschler's netIOT edge gateway can effectively reduce this part of the work, through the passive mode of “listening”, can automatically obtain the process data in the automation network, and send the required data to the cloud for IoT application. This kind of application does not affect the performance of the original automation network data communication, and it can quickly transfer the process data to the cloud without any modification. In addition, this passive mode of access can ensure that the OT network data and the IT network data are isolated and do not interfere with each other, regardless of whether they are intentional or unintentional.

NetIOT edge gateway installation and debugging is also very simple. The device integrates network TAP technology, which only needs to be intermittent in production, and it is connected to the network of PLCs and field devices. Once the network cable is reconnected, production can continue. After the netIOT edge gateway is installed, it can be parameterized to implement various IoT applications so that it will not affect the production operation. The on-site process data is implemented via OPCUA or Node-RED.

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Panasonic provides extremely dependable electronics assembly equipment in the areas of SMT (surface mount technology), PTH (pin through-hole), and processes involving microelectronics back-end packaging of any-mix circuit manufacturing. We offer first-class equipment ranging from screen printers and dispensing, through component placement and inspection, up to axial and radial insertion, die bonding, die attach and flip chip. Our equipment is used all around the world to enable the production of the most modern technology.

Our variable machines in modular format support a large range of technologies and, from the installation of just one machine through to assemblies of over 1,000, can take care of processes such as, COB (chip on board), SOP (system on package), epoxy die attach, POP (package on package), 3D packaging, TS (thermo-sonic) and TC (thermo-compression) processing, plasma RIE surface cleaning, plasma ICP etching, and thin wafer plasma dicing. To perform odd-form placement and end-of-line work, we also offer automated equipment.

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Shenzhen Keith Electronic Equipment Co., Ltd. , https://www.aismtks.com