LED lighting applications have been strongly promoted by the government and industry in China. The introduction of “Ten Cities and Ten Thousand†demonstration projects and “phase-out of incandescent lamps†has provided a powerful driving force for LEDs to replace traditional light sources. LED driver power supply instability is the industry consensus, it dragged the LED lighting industry for 1-2 years. For general lighting LED driver power control IC solutions, these solutions can help Chinese companies develop stable, reliable and cost-effective drive power. How to solve bottlenecks in lighting and backlight applications in LED packages. On June 10th, at the "6th LED Industry Theme Summit Forum" hosted by Gaogong LED, Gong Weibin, general manager of Ruifeng Optoelectronics, made a "bottleneck and solution for LED packaging in lighting and backlight applications". Wonderful speech. Gong Weibin pointed out that LED lighting has higher power and higher requirements for heat dissipation and light decay; while backlighting is mainly for consistency requirements. However, LED TV color rendering and reliability are the key points. Consumers choose LED TV mainly to be optimistic about its color performance. At the same time, for LED TV, one LED is broken, and the whole TV is darkened. This is a difficult for many domestic companies. He believes that the solution is mainly the improvement of light efficiency, the solution of heat dissipation, the way of phosphor distribution and the development of high reliability materials. Gong Weibin said that the thinner the phosphor coating, the higher the efficiency obtained. From the packaging materials, it can be seen that the thermal resistance of the chip substrate material and the solid crystal material becomes the bottleneck of the thermal resistance of the high-power LED assembly. He also cited the advantages of eutectic flip-chip technology. He believes that the eutectic process will greatly improve the reliability of the high-power LED components due to the reduction of the overall thermal resistance for high-power LEDs. For a 40 mil chip, the thermal resistance can be controlled at 1 W/mk. By using a eutectic process and other packages, the overall thermal resistance can be controlled within 6 W/mk. He said that in the domestic unsatisfactory equipment, the use of solder paste can only be said to be a temporary measure, and the supporting substrate materials also need to be selected. The advantage of flip chip technology is that it can improve the light extraction efficiency of the wafer and improve the heat dissipation path. Hydrogel Film,Film Tpu Flexible Hd,Hydrogel Vs Glass,Tpu Film Shenzhen TUOLI Electronic Technology Co., Ltd. , https://www.hydrogelprotector.com
LED backlight, since 2004, Sony introduced the first LED-backlit LCD TV. Since LED backlight has low voltage start-up, good operability, solid-state illumination source, long life and wide color gamut, LED is rapidly An ideal light-emitting device for today's backlights.
However, the problem of LED backlight efficacy cooling can not be ignored. In order to improve the practicality of LED lighting and backlight applications, the industry has invested huge financial and energy resources in improving power supply, luminous efficiency, reliability and heat dissipation packaging technology. 