[Golden Globe Award] The difficulty of the craftsman lies in the 'smith', but also in the 'heart'. The mega-capacity CSP packaged device won the golden ball crown!

As an important form of packaging, CSP has attracted much attention in the LED industry in recent years and is also the most controversial technology.

In the past two years, almost every year, people are asking, "Is the first year of CSP coming?" Of course, there are also many "masters" who have predicted with categorical conclusions: "It is next year, next year will definitely become the mainstream."

In fact, every year CSP has not been able to sweep the market as predicted. Even the application side has always had a misunderstanding of CSP performance and difficulty in using it. After the market subsidence in the last two years, more and more customers are designing products for the characteristics of CSP, such as CSP that has been used in large quantities in the lamp industry. The product is the application end for CSP small size, high density illumination, high temperature resistance and high stability.

The high-tech LED Golden Globe Awards annual selection campaign aims to explore and promote the outstanding technology, products and brands of the LED industry chain, and encourage enterprises to establish their determination and confidence to strive for the industry benchmark. It aims to select good products and good brands to establish industry benchmarks. .

The 2017 High-tech LED Golden Globe Awards were selected as "one enterprise, one ingenuity, the hardship of the craftsman is the 'smith', and the other is the 'heart'" theme. Since the opening of the registration channel in early November, more than 130 LED industry chains have been launched. The upper, middle and lower reaches of the company sign up for participation. Participating companies cover the entire industry chain of LED materials, equipment, chips, packaging, power, IC, lighting.

On December 22nd, the 2017 Gaogong LED Golden Globe Awards Ceremony was successfully concluded at Shenzhen Baoan Dunxi International Hotel.

On-site industry elites witnessed the LED industry's annual grand ceremony. The Golden Globe Awards Ceremony was exclusively named by Lande Vans, and the Golden Globe Awards Ceremony was also supported by Zhang Fei's power supply and excitation testing.

It is worth mentioning that the high-tech LED Golden Globe Awards ceremony announced the results of the 2017 annual flip-chip / CSP package device annual innovation selection, Zhaochi energy-saving lighting won the Golden Globe Award.

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Shenzhen Zhaochi Energy Saving Lighting Co., Ltd. (referred to as Zhaochi Energy Saving, Securities Code 838750) was founded in April 2011 with a registered capital of RMB 170 million. It is headquartered in Shenzhen, China and has two production bases in Shenzhen and Nanchang. Leading LED devices and components are researched and produced in a new three-board listing company.

The company's products are positioned in two core areas of LED lighting and LED backlight. With its solid foundation in product development, technological innovation and market development, the company has become one of the major suppliers of medium and large-sized LED backlights in the field of LED backlighting. In the LED lighting market, it has been highly recognized by first-line brand customers.

The third generation of ultra-high-efficiency CSP products launched by Zhaochi Energy-saving Lighting has been redesigned in structure on the structure of ordinary single-sided CSP products, through special processing of flip chip and increased reflective glass structure with high reflectivity (as shown below). The side light of the flip chip can be fully utilized and exported, greatly improving the light efficiency of the CSP product. At the same time, the reflective structure of the new CSP is better than that of the conventional PCB. In practical applications, the light performance is far superior to that of the five-sided CSP structure.

All in all, the third generation of ultra-high-efficiency CSP products can effectively improve the light efficiency of CSP products, thereby reducing the junction temperature of flip-chips in CSP products, enabling higher lifespan for flip-chip wafers of the same size, further enhancing the overall CSP products. Service life. At the same time, the temperature reduction can reduce the reliability requirements of CSP products other than the wafer, which can further reduce the raw material cost of the product.


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